3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, glass and display markets, announced that a supplier leader in optical solutions had purchased several microMIRA™ Laser Lift-Off (LLO) systems from 3D-Micromac for use in the production of microLED devices.
The customer will install the new microMIRA systems in the pilot and production lines of its state-of-the-art LED chip factory in Asia.
Laser Lift-Off, an enabling process for microLEDs
MicroLEDs have the potential to revolutionize the display industry, promising a variety of benefits such as superior viewing angle, high dynamic range with perfect black luminance and high brightness, wide color gamut, fast refresh rates, long life and low power consumption. Potential applications include very large displays for indoor and outdoor use, as well as high-resolution displays for wearable augmented reality (AR) and virtual reality (VR) devices.
However, the manufacturing process for microLEDs is much more complex than manufacturing LCDs and OLEDs, and faces several technical challenges that must be overcome before microLEDs can be readily available in the mass market. Among these challenges is the detachment and transfer of processed microLED chips from the donor or growth substrate (e.g., sapphire) to an intermediate substrate for further testing without damaging the expensive growth substrate, allowing it to be reused for future use. 3D-Micromac’s microMIRA system meets precisely this task with superior performance.
3D-Micromac’s microMIRA™ laser system enables highly uniform, force-free peel-off of different layers on large surface area substrates at high processing speeds without the need for expensive and polluting wet chemical processes.
3D-Micromac’s microMIRA system enables highly uniform, force-free peeling of different layers on large surface area substrates at high processing speeds without the need for expensive and polluting wet chemical processes. The unique linear beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths, and beam paths to meet each customer’s unique requirements. The system is capable of processing various substrate materials and sizes, and can achieve processing speeds (including handling) of up to 60 eight-inch wafers per hour.
According to Uwe Wagner, CEO of 3D-Micromac, “This multiple systems order demonstrates our ability to provide innovative and enabling laser micromachining solutions for industrial applications serving both mature and emerging markets. It also represents an important milestone for 3D-Micromac as we continue to expand our product and service offerings in the display industry, meeting the production needs of exciting new display technologies, including microLEDs. To date, 3D-Micromac has sold more than 10 laser processing systems for microLED applications, including our industry-leading microMIRA laser peeling system as well as our recently introduced microCETI™ micromachining platform.
The microMIRA LLO system has been used successfully in mass production by electronics manufacturers around the world for years. In addition to the stripping of gallium nitride (GaN) from glass and sapphire substrates in the manufacture of microLED displays, the microMIRA system can also be used for layer separation in the manufacture of semiconductors and sensors, as well than for laser annealing and crystallization for surface modification.
Charging port for wafer cassettes for the microMIRA laser system. The system is capable of processing various substrate materials and sizes, and can achieve processing speeds (including handling) of up to 60 eight-inch wafers per hour. Source: 3D-Micromac.
Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly, state-of-the-art processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries around the world, including photovoltaics, semiconductors, glass and display, microdiagnostics and medical technology.
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